Essential PC Hardware Glossary for Indian Builders
A complete, rephrased guide to PC components and terms to help Indian shoppers choose the right parts.
Safety level: informational · Level: beginner
A
AM4 / AM5 sockets – Physical CPU interfaces on AMD motherboards. AM4 accommodates Ryzen 1‑series through Ryzen 5‑series (1000‑5000) chips, while AM5 is designed for the newer Ryzen 7‑series (7000‑9000) and supports DDR5 memory and PCIe 5.0 lanes.
Air cooler – A processor cooling solution that combines a metal heatsink with one or more fans. It is generally easier to install and more dependable than liquid‑based coolers, though it can be larger and heavier.
All‑In‑One (AIO) liquid cooler – A sealed liquid‑cooling loop that includes a pump, radiator and fans. It typically delivers lower temperatures than most air coolers, but comes at a higher price point.
B
Bottleneck – A situation where a weaker component restricts the performance of a stronger one, for example a modest CPU limiting the output of a high‑end graphics card. Spotting bottlenecks helps you balance the system.
BIOS – The low‑level firmware that initializes hardware before the operating system loads. Modern BIOS/UEFI interfaces also let users tweak overclock settings and fan curves.
B550 / B650 chipsets – AMD motherboard controllers. B550 works with AM4 boards for Ryzen 3000‑5000 CPUs, while B650 pairs with AM5 boards for Ryzen 7000‑9000 CPUs and adds native DDR5 support.
C
Chipset – The motherboard’s central hub that routes data among the CPU, memory, storage and peripherals. It defines the number of USB ports, PCIe lanes, and whether overclocking is possible.
Core i5 / i7 / i9 – Intel’s tiered processor families. Core i5 targets mainstream users, i7 aims at enthusiasts, and i9 serves the flagship segment for demanding gaming and productivity workloads.
CPU (Central Processing Unit) – The main processor that executes instructions for games, applications and the operating system. In gaming rigs it works together with a GPU to deliver frame rates.
Case airflow – The pattern of air movement inside a PC chassis, typically front‑to‑back or bottom‑to‑top. Proper airflow keeps components cool and reduces fan noise.
D
DDR4 / DDR5 – Two generations of system memory. DDR4 is the older, more affordable type, while DDR5 offers greater bandwidth and is required for the latest Ryzen 7000‑9000 and Intel 12th‑gen+ CPUs.
DRAM (Dynamic Random‑Access Memory) – The volatile memory used as system RAM. It differs from VRAM, which belongs to the graphics card, and from storage devices like SSDs or HDDs.
Dust filters – Mesh screens placed over case intake vents to stop dust from entering the interior. They prolong component life but need periodic cleaning.
E
EPS 12V connector – The 8‑pin power plug on a motherboard that supplies dedicated voltage to the CPU, separate from the main 24‑pin ATX connector.
E‑ATX – An extended ATX motherboard size that is larger than standard ATX, requiring a spacious case and offering extra expansion slots.
F
FPS (Frames Per Second) – The count of individual images a graphics card can render each second. Higher FPS yields smoother motion, especially on high‑refresh monitors.
Fan curve – A plotted relationship between temperature and fan speed, allowing users to set how aggressively fans spin as components heat up.
Form factor – The standardized physical dimensions for components such as motherboards (ATX, micro‑ATX, mini‑ITX) or power supplies (ATX, SFX). It dictates which cases can accommodate them.
G
GPU (Graphics Processing Unit) – The dedicated graphics processor that draws images on the screen and handles parallel compute tasks. It is the primary determinant of gaming performance.
G‑Sync / FreeSync – Adaptive‑sync technologies that align a monitor’s refresh rate with the GPU’s output to eliminate tearing. G‑Sync is NVIDIA’s proprietary solution; FreeSync is AMD’s open standard.
H
HDD (Hard Disk Drive) – A magnetic storage device with rotating platters. It offers large capacities at low cost but is slower than solid‑state drives.
Heatsink – A metal block with fins that absorbs heat from a CPU or GPU. It must be paired with a fan or liquid loop to move the heat away.
I
Integrated graphics – A graphics processor built into the CPU, such as AMD’s Radeon Graphics or Intel’s UHD/Xe cores. Sufficient for office work and media playback, but not for modern gaming.
I/O shield – The metal plate that fits into the back of a case, covering the motherboard’s rear ports and shielding against dust and electromagnetic interference.
K
RAM kit – A matched set of two or four memory modules sold together to ensure optimal dual‑channel or quad‑channel performance. Kits are usually labeled by total capacity, e.g., 2 × 8 GB.
L
LGA1700 / LGA1851 sockets – Intel’s land‑grid CPU sockets. LGA1700 supports 12th‑ to 14th‑generation processors, while LGA1851 is intended for the upcoming Arrow Lake (15th‑gen) CPUs and requires DDR5.
Liquid cooling – A cooling method that circulates coolant through a block attached to the CPU or GPU, then passes it through a radiator where fans dissipate the heat. It offers superior thermal performance but adds complexity.
M
M.2 NVMe SSD – A compact solid‑state drive that plugs directly into an M.2 slot and uses the NVMe protocol over PCIe lanes, delivering far higher throughput than SATA SSDs.
Micro‑ATX (MATX) – A motherboard size smaller than full‑size ATX, fitting comfortably in mid‑tower cases while providing a moderate number of expansion slots.
Motherboard – The central printed circuit board that interconnects all components, defining the CPU socket, memory type, storage interfaces and expansion options.
N
NVMe (Non‑Volatile Memory Express) – A high‑speed storage protocol that runs over PCIe, offering three to seven times the bandwidth of traditional SATA SSDs.
NIC (Network Interface Card) – The Ethernet or Wi‑Fi adapter that provides network connectivity. Most modern motherboards include an integrated NIC.
O
Overclocking – Raising the operating frequency of a CPU, GPU or RAM beyond the manufacturer’s default to gain extra performance, which also raises power consumption and heat output.
OC (Overclocked) – A shorthand used in product names to indicate a factory‑tuned higher clock speed, such as "RTX 5070 OC".
P
PCIe (Peripheral Component Interconnect Express) – The primary expansion slot standard for graphics cards, NVMe SSDs and other add‑in cards. Versions 4.0 and 5.0 provide increasingly wider bandwidth.
PSU (Power Supply Unit) – The component that converts mains electricity to the DC voltages required by the PC. Reputable brands like Corsair, Seasonic and be quiet! are known for stable output.
PWM (Pulse Width Modulation) – A method of controlling fan speed by varying the duty cycle of the voltage signal, allowing finer speed adjustments than simple 3‑pin DC fans.
Q
QVL (Qualified Vendor List) – A manufacturer‑provided list of memory modules that have been tested and verified to work with a specific motherboard model.
R
RGB (Red‑Green‑Blue) lighting – Programmable illumination on components such as fans, RAM sticks and cases, controllable via software suites like Corsair iCUE or ASUS Aura.
RAM (Random‑Access Memory) – Fast, volatile memory used for active workloads. In 2026, 16 GB is considered the baseline for gaming, while 32 GB benefits content creators.
Ryzen 5 / 7 / 9 – AMD’s tiered processor families. Ryzen 5 targets mainstream users, Ryzen 7 serves enthusiasts, and Ryzen 9 is the top‑end offering for high‑performance gaming and workstation tasks.
S
Socket – The physical slot on a motherboard where the CPU is installed. Current examples include AM4, AM5, LGA1700 and LGA1851.
SSD (Solid‑State Drive) – Storage that uses flash memory for rapid data access. The M.2 NVMe variant is now the default choice for gaming PCs.
SATA – An older interface for connecting SSDs and HDDs. It is slower than NVMe but remains common for budget drives and 2.5‑inch form factors.
SFX PSU – A compact power‑supply form factor designed for small‑form‑factor (SFF) builds such as mini‑ITX cases.
T
TDP (Thermal Design Power) – The maximum amount of heat a CPU or GPU is expected to generate under typical load, expressed in watts. It guides the selection of cooling solutions and PSU capacity.
Thermal paste – A conductive compound placed between a processor and its cooler to improve heat transfer. Many coolers ship with pre‑applied paste, though enthusiasts may apply aftermarket variants.
Threadripper – AMD’s high‑end desktop (HEDT) line featuring 16‑64 cores, aimed at workstation workloads like rendering and scientific computing rather than mainstream gaming.
U
USB (Universal Serial Bus) – The universal connector standard for peripherals. USB 3.2 Gen 2 and USB4 provide the fastest data rates for external drives and docking stations.
UV (Under‑Voltage) – The practice of lowering the operating voltage of a CPU or GPU to reduce heat and power draw while maintaining performance, popular in silent or compact builds.
V
VRM (Voltage Regulator Module) – The circuitry on a motherboard that supplies clean, stable power to the CPU. Robust VRMs are essential for stable overclocking and high‑core‑count processors.
VRAM (Video RAM) – Dedicated memory on a graphics card used for textures, frame buffers and other visual data. 8 GB is the minimum for 1080p gaming; 12 GB or more is advisable for 1440p‑4K.
V‑Sync – A display option that caps the frame rate to match the monitor’s refresh rate, preventing tearing but potentially adding input lag; competitive gamers often disable it.
W
Wattage (PSU rating) – The total power a power supply can deliver. A 650 W unit comfortably powers a system with an RTX 5060‑class GPU, while 850 W or higher is recommended for RTX 5080‑5090‑class cards.
X
XMP (Extreme Memory Profile) – Intel’s predefined memory overclocking settings stored in SPD that can be enabled in BIOS for higher speeds. AMD’s counterpart is called EXPO for Ryzen 7000‑9000 platforms.
X670 / X870 chipsets – AMD’s premium motherboard controllers for AM5 sockets, offering the greatest number of PCIe lanes, USB ports and overclocking capabilities compared with B‑series boards.
FAQ
Q: What does TDP indicate?
A: TDP, or Thermal Design Power, specifies the maximum heat a processor or graphics chip will emit under typical load, expressed in watts. It helps you choose an appropriate cooler and power‑supply capacity.
Q: How can I recognise a bottleneck in my build?
A: A bottleneck appears when one component, such as a low‑end CPU, restricts the performance potential of another, like a high‑end GPU. Balancing component levels prevents wasted investment.
Q: What’s the difference between a socket and a chipset?
A: The socket is the physical slot on the motherboard where the CPU is mounted (e.g., AM4, LGA1700). The chipset is the motherboard’s controller that determines features like USB count, PCIe lane version and overclocking support.
What This Means for Indian Buyers
For shoppers in Mumbai and across India, this terminology guide helps you compare locally available parts and understand how they fit together. When selecting a motherboard, verify whether it uses an AM4, AM5, LGA1700 or LGA1851 socket, as this dictates which CPUs you can install. DDR5 memory and PCIe 5.0 devices are becoming more common, but DDR4 and PCIe 4.0 remain widely stocked and often cheaper. Consider the power‑supply wattage needed for the GPU you plan to use—650 W is sufficient for most mid‑range cards, while high‑end RTX 5080‑class GPUs benefit from 850 W or more. Good case airflow and dust‑filter maintenance are essential in the dusty climate of Mumbai. Finally, if you are building a compact system, look for SFX power supplies and mini‑ITX or micro‑ATX boards, but ensure the VRM quality can handle any overclocking you intend.
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Last reviewed 2026-09-10.