Gigabyte B760 GAMING X WIFI6E GEN5 LGA1700 Motherboard
Brand: Gigabyte
SKU: B760-GAMING-X-WIFI6E-GEN5
Price: ₹16,899 (inclusive of GST · genuine product with warranty)
PCIe Gen5 Performance : Perfect Sync to Win Supports Intel® Core™ 14th/ 13th/12 processors Efficient Thermal : VRM Thermal Armor Advanced & M.2 Thermal Guard WIFI EZ-Plug : Quick and easy design for Wi-Fi antenna installation
Specifications
| color | Black |
|---|---|
| Socket | LGA 1700 |
| Platform | INTEL |
| RAM type | DDR5 |
| Warranty | 3 Years |
| Product Type | Normal |
| Motherboard Size | ATX |
About this product
Gigabyte B760 GAMING X WIFI6E GEN5 LGA1700 Motherboard
Feature
PCIe Gen5 Performance : Perfect Sync to Win
Supports Intel® Core™ 14th/ 13th/12 processors
Efficient Thermal : VRM Thermal Armor Advanced & M.2 Thermal Guard
WIFI EZ-Plug : Quick and easy design for Wi-Fi antenna installation
WIFI Compass : Auto detects the best antenna position for strongest Wi-Fi signal
EZ-Latch : PCIe 5.0×16 Slot with Quick Release Design
PCIe UD Slot : SMD PCIe 5.0 Armor for enhanced graphics card support
Unparalleled Performance : Hybrid 8+1+1 Phases VRM Solution
Dual Channel DDR5 : 4*DIMMs with XMP Memory Module Support
Fast Networks : 2.5GbE LAN & Wi-Fi 6E 802.11ax
Extended Connectivity : Front USB-C® 10Gb/s, DP, HDMI
Next Generation Storage : 3*PCIe 4.0 x4 M.2 Connectors
Smart Fan 6 : Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
Q-Flash Plus : Update BIOS Without Installing the CPU, Memory and Graphics Card
PCIe Gen5
Express to PCIE5 Performance
The new GIGABYTE B760 motherboards provides the most efficient solution to enjoy boosted performance of PCIe Gen5 on the existing platform. PCIe 5.0 doubles the data transfer rate of PCIe 4.0 from 16 GT/s to 32 GT/s per lane. This substantial increase in bandwidth particularly benefits high-performance graphics cards, storage devices, and AI accelerators that demand faster data movement.
Cooling
Fully Covered Thermal Design
High coverage MOSFET and integrated molding Heatsinks to improve thermal efficiency with better airflow and heat exchange.
4X Large Surface
Increased surface area up to 4X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs.
Real One-piece Build
TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors’ multi-piece design.
Multi-Cut Design
TMOS features several channels and inlets on the heatsink. This design allows for the air flow to go through which leads to a great improvement of the heat transfer performance.
M.2 Thermal Guard
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